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"Impact of Gold Interconnect Microstructure on Electromigration Failure ..."

Hajdin Ceric, Roberto Lacerda de Orio, Siegfried Selberherr (2022)

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DOI: 10.1109/ESSDERC55479.2022.9947168

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-19

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  dblp key:
  - conf/essderc/CericOS22
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  - https://dblp.org/rec/conf/essderc/CericOS22
Hajdin Ceric, Roberto Lacerda de Orio, Siegfried Selberherr:
Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics. ESSDERC 2022: 301-303

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