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"TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC."

Jonghoon J. Kim et al. (2015)

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DOI: 10.1109/EMCCOMPO.2015.7358359

access: closed

type: Conference or Workshop Paper

metadata version: 2019-06-13

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  dblp key:
  - conf/emccompo/KimJKKCLK15
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  - https://dblp.org/rec/conf/emccompo/KimJKKCLK15
Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim:
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo 2015: 212-215

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