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"Timing-Aware Tier Partitioning for 3D ICs with Critical Path Consideration."

Sojung Park, Heechun Park (2024)

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DOI: 10.1109/ICEIC61013.2024.10457092

access: closed

type: Conference or Workshop Paper

metadata version: 2024-04-02

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  dblp key:
  - conf/elinfocom/ParkP24
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  - https://dblp.org/rec/conf/elinfocom/ParkP24
Sojung Park, Heechun Park:
Timing-Aware Tier Partitioning for 3D ICs with Critical Path Consideration. ICEIC 2024: 1-4

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