"A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for ..."

Seung-Mo Noh et al. (2024)

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DOI: 10.1109/ICEIC61013.2024.10457196

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Seung-Mo Noh, Seungkyu Kim, Seo-Yoon Lee, Kee-Won Kwon:
A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages. ICEIC 2024: 1-4

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