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"Devices and circuits for HF applications based on 2D materials."

Simon Skrzypczak et al. (2023)

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DOI: 10.1109/DCIS58620.2023.10335977

access: closed

type: Conference or Workshop Paper

metadata version: 2024-01-08

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  dblp key:
  - conf/dcis/SkrzypczakZWFVP23
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  - https://dblp.org/rec/conf/dcis/SkrzypczakZWFVP23
Simon Skrzypczak, Di Zhou, Wei Wei, Dalal Fadil, Dominique Vignaud, Emiliano Pallecchi, Henri Happy:
Devices and circuits for HF applications based on 2D materials. DCIS 2023: 1-5

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