"Cost-driven 3D integration with interconnect layers."

Xiaoxia Wu et al. (2010)

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DOI: 10.1145/1837274.1837313

access: closed

type: Conference or Workshop Paper

metadata version: 2025-02-07

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Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna Das, Yuan Xie, Chita R. Das, Jian Li:
Cost-driven 3D integration with interconnect layers. DAC 2010: 150-155

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