"Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling ..."

Jinwoo Kim et al. (2019)

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DOI: 10.1145/3316781.3317775

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-26

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Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chaitanya Krishna Chekuri, Nihar Dasari, Arvind Singh, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim:
Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse. DAC 2019: 178

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