"Three-dimensional Integration (3DI) with Bumpless Interconnects for ..."

Koji Sakui, Takayuki Ohba (2019)

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DOI: 10.1109/CICC.2019.8780385

access: closed

type: Conference or Workshop Paper

metadata version: 2019-08-07

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Koji Sakui, Takayuki Ohba:
Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform. CICC 2019: 1-6

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