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"Stacking technology based on 8-inch wafers using direct connection between ..."

Nobuaki Miyakawa et al. (2008)

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DOI: 10.1109/CICC.2008.4672169

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Nobuaki Miyakawa, Eiri Hashimoto, Takanori Maebashi, Natsuo Nakamura, Yutaka Sacho, Shigeto Nakayama, Shinjiro Toyoda:
Stacking technology based on 8-inch wafers using direct connection between TSV and micro-bump. CICC 2008: 647-650

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