Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"A new IC interconnection scheme and design architecture for high ..."

M. S. Lin et al. (2003)

> Home

Details and statistics

DOI: 10.1109/CICC.2003.1249454

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-15

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/cicc/LinCLLCWCCHL03
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/cicc/LinCLLCWCCHL03
M. S. Lin, Ling Chen, J. Y. Lee, H. T. Liu, C. K. Chou, K. H. Wan, H. M. Chen, Kevin Chou, Roger Hsiao, Eric Lin:
A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection. CICC 2003: 533-536

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.