Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Three-dimensional integration technology using through-si via based on ..."

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka (2010)

> Home

Details and statistics

DOI: 10.1109/CICC.2010.5617626

access: closed

type: Conference or Workshop Paper

metadata version: 2019-12-27

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/cicc/KoyanagiFT10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/cicc/KoyanagiFT10
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka:
Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding. CICC 2010: 1-4

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.