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"ThermalPen: Adding Thermal Haptic Feedback to 3D Sketching."

Philipp Pascal Hoffmann et al. (2023)

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DOI: 10.1145/3544549.3583901

access: closed

type: Conference or Workshop Paper

metadata version: 2023-04-29

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  dblp key:
  - conf/chi/HoffmannEMWM23
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  - https://dblp.org/rec/conf/chi/HoffmannEMWM23
Philipp Pascal Hoffmann, Hesham Elsayed, Max Mühlhäuser, Rina R. Wehbe, Mayra Donaji Barrera Machuca:
ThermalPen: Adding Thermal Haptic Feedback to 3D Sketching. CHI Extended Abstracts 2023: 474:1-474:4

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