"Effects of lead widths and pitches on reliability of soldered joints and ..."

Songbai Xue et al. (2006)

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DOI: —

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type: Conference or Workshop Paper

metadata version: 2006-12-01

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  dblp key:
  - conf/cgvr/XueWHZ06
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  persistent URL:
  - https://dblp.org/rec/conf/cgvr/XueWHZ06
Songbai Xue, Yuxiu Wu, Zongjie Han, Ling Zhang:
Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. CGVR 2006: 168-174

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