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"Modeling of Tape Automated Bonding (TAB) for High Performance Integrated ..."

N. Hassaïne et al. (2006)

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DOI: 10.1109/CCECE.2006.277504

access: closed

type: Conference or Workshop Paper

metadata version: 2021-03-04

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  - conf/ccece/HassaineVSC06
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N. Hassaïne, L. Villeneuve, Y. Shen, F. Concilio:
Modeling of Tape Automated Bonding (TAB) for High Performance Integrated Circuits. CCECE 2006: 2464-2467

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