"Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for ..."

Myeong-Hyeok Jeong et al. (2011)

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type: Conference or Workshop Paper

metadata version: 2013-02-28

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  - conf/biostec/JeongKKPKJ11
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  - https://dblp.org/rec/conf/biostec/JeongKKPKJ11
Myeong-Hyeok Jeong, Jae-Won Kim, Byung-Hyun Kwak, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo:
Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. BIODEVICES 2011: 311-314

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