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ORCID"A TSV Repair Scheme Using Enhanced Test Access Architecture for 3-D ICs."
Chi-Chun Yang, Che-Wei Chou, Jin-Fu Li (2013)
- Chi-Chun Yang, Che-Wei Chou, Jin-Fu Li:
A TSV Repair Scheme Using Enhanced Test Access Architecture for 3-D ICs. Asian Test Symposium 2013: 7-12
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