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"Multi-visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a ..."
Chun-Chuan Chi et al. (2011)
- Chun-Chuan Chi, Erik Jan Marinissen
, Sandeep Kumar Goel, Cheng-Wen Wu
:
Multi-visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a Passive Silicon Interposer Base. Asian Test Symposium 2011: 451-456
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