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"A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration."

Xiping Jiang et al. (2021)

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DOI: 10.1109/A-SSCC53895.2021.9634704

access: closed

type: Conference or Workshop Paper

metadata version: 2021-12-21

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  dblp key:
  - conf/asscc/JiangZWZYWLLKR21
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  - https://dblp.org/rec/conf/asscc/JiangZWZYWLLKR21
Xiping Jiang, Fengguo Zuo, Song Wang, Xiaofeng Zhou, Bing Yu, Yubing Wang, Qi Liu, Ming Liu, Yi Kang, Qiwei Ren:
A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration. A-SSCC 2021: 1-3

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