"Modeling and design analysis of 3D vertical resistive memory - A low cost ..."

Cong Xu et al. (2014)

> Home

Details and statistics

DOI: 10.1109/ASPDAC.2014.6742992

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-21

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/aspdac/XuNYX14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/aspdac/XuNYX14
Cong Xu, Dimin Niu, Shimeng Yu, Yuan Xie:
Modeling and design analysis of 3D vertical resistive memory - A low cost cross-point architecture. ASP-DAC 2014: 825-830

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.