Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs."

Xingyu Tong et al. (2024)

> Home

Details and statistics

DOI: 10.1109/ASP-DAC58780.2024.10473921

access: closed

type: Conference or Workshop Paper

metadata version: 2024-08-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/aspdac/TongCZWWLC24
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/aspdac/TongCZWWLC24
Xingyu Tong, Zhijie Cai, Peng Zou, Min Wei, Yuan Wen, Zhifeng Lin, Jianli Chen:
O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs. ASPDAC 2024: 71-76

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.