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"O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs."
Xingyu Tong et al. (2024)
- Xingyu Tong, Zhijie Cai, Peng Zou, Min Wei, Yuan Wen, Zhifeng Lin, Jianli Chen:
O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs. ASPDAC 2024: 71-76
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