BibTeX record conf/aspdac/HsuCH13

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@inproceedings{DBLP:conf/aspdac/HsuCH13,
  author    = {Po{-}Yang Hsu and
               Hsien{-}Te Chen and
               TingTing Hwang},
  title     = {Stacking signal {TSV} for thermal dissipation in global routing for
               3D {IC}},
  booktitle = {18th Asia and South Pacific Design Automation Conference, {ASP-DAC}
               2013, Yokohama, Japan, January 22-25, 2013},
  pages     = {699--704},
  publisher = {{IEEE}},
  year      = {2013},
  url       = {https://doi.org/10.1109/ASPDAC.2013.6509682},
  doi       = {10.1109/ASPDAC.2013.6509682},
  timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
  biburl    = {https://dblp.org/rec/conf/aspdac/HsuCH13.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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