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"Block-level designs of die-to-wafer bonded 3D ICs and their design quality ..."

Krit Athikulwongse et al. (2013)

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DOI: 10.1109/ASPDAC.2013.6509680

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  - conf/aspdac/AthikulwongseKJL13
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Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim:
Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs. ASP-DAC 2013: 687-692

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