"Analytical model of the coupling capacitance between cylindrical through ..."

Wenjian Yu, Siyu Yang, Qingqing Zhang (2013)

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DOI: 10.1109/ASICON.2013.6812067

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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Wenjian Yu, Siyu Yang, Qingqing Zhang:
Analytical model of the coupling capacitance between cylindrical through silicon via and horizontal interconnect in 3D IC. ASICON 2013: 1-4

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