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"Three-dimensional on-chip inductor design based on through-silicon vias."

Feng Liang et al. (2013)

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DOI: 10.1109/ASICON.2013.6812066

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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  dblp key:
  - conf/asicon/LiangZCW13
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  - https://dblp.org/rec/conf/asicon/LiangZCW13
Feng Liang, Si-Qi Zhao, Aobo Chen, Gaofeng Wang:
Three-dimensional on-chip inductor design based on through-silicon vias. ASICON 2013: 1-3

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