Stop the war!
Остановите войну!
for scientists:
default search action
"A thermal-aware distribution method of TSV in 3D IC."
Ligang Hou et al. (2015)
- Ligang Hou, Jingyan Fu, Jinhui Wang, Na Gong, Wei Zhao, Shuqin Geng:
A thermal-aware distribution method of TSV in 3D IC. ASICON 2015: 1-3
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.