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"Challenges and trends in low-power 3D die-stacked IC designs using RAM, ..."

Meng-Fan Chang et al. (2011)

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DOI: 10.1109/ASICON.2011.6157181

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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Meng-Fan Chang, Pi-Feng Chiu, Wei-Cheng Wu, Ching-Hao Chuang, Shyh-Shyuan Sheu:
Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM). ASICON 2011: 299-302

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