"Challenges in testing TSV-based 3D stacked ICs: Test flows, test contents, ..."

Erik Jan Marinissen (2010)

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DOI: 10.1109/APCCAS.2010.5775087

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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Erik Jan Marinissen:
Challenges in testing TSV-based 3D stacked ICs: Test flows, test contents, and test access. APCCAS 2010: 544-547

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