"Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment ..."

Zaiyong Liu, Hai-Bao Chen, Tianshu Hou (2020)

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DOI: 10.1109/APCCAS50809.2020.9301690

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-27

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Zaiyong Liu, Hai-Bao Chen, Tianshu Hou:
Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires. APCCAS 2020: 62-65

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