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"TSV-aware 3-D IC structural planning with irregular die-size."

Arko Dutt, Pranab Roy, Hafizur Rahaman (2016)

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DOI: 10.1109/APCCAS.2016.7804074

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-22

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Arko Dutt, Pranab Roy, Hafizur Rahaman:
TSV-aware 3-D IC structural planning with irregular die-size. APCCAS 2016: 713-716

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