"Simultaneous wafer bonding type selection and layer assignment for TSV ..."

Chun-Hua Cheng, Wei-Shuo Tzeng, Shih-Hsu Huang (2012)

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DOI: 10.1109/APCCAS.2012.6419113

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Chun-Hua Cheng, Wei-Shuo Tzeng, Shih-Hsu Huang:
Simultaneous wafer bonding type selection and layer assignment for TSV count minimization. APCCAS 2012: 627-630

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