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"Characterization of Interconnects on Multilayer High Frequency PCB for D- ..."

Antti Lamminen et al. (2020)

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DOI: 10.1109/6GSUMMIT49458.2020.9083918

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  - conf/6gsummit/LamminenLRSSE20
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  - https://dblp.org/rec/conf/6gsummit/LamminenLRSSE20
Antti Lamminen, Markku Lahti, David del Rio, Jussi Säily, Juan F. Sevillano, Vladimir Ermolov:
Characterization of Interconnects on Multilayer High Frequency PCB for D- Band. 6G SUMMIT 2020: 1-5

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