"Fabrication and packaging of microbump interconnections for 3D TSV."

Seung Wook Yoon et al. (2009)

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DOI: 10.1109/3DIC.2009.5306554

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Seung Wook Yoon, Jae Hoon Ku, Nathapong Suthiwongsunthorn, Pandi Chelvam Marimuthu, Flynn Carson:
Fabrication and packaging of microbump interconnections for 3D TSV. 3DIC 2009: 1-5

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