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"Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip ..."

Yi-Chieh Tsai, Chia-Hsuan Lee, Kuan-Neng Chen (2019)

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DOI: 10.1109/3DIC48104.2019.9058877

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-03

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  dblp key:
  - conf/3dic/TsaiLC19
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  - https://dblp.org/rec/conf/3dic/TsaiLC19
Yi-Chieh Tsai, Chia-Hsuan Lee, Kuan-Neng Chen:
Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. 3DIC 2019: 1-4

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