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"Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC."

Menglin Tsai et al. (2009)

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DOI: 10.1109/3DIC.2009.5306569

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/TsaiKLAF09
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  - https://dblp.org/rec/conf/3dic/TsaiKLAF09
Menglin Tsai, Amy Klooz, Alexander Leonard, Jennie Appel, Paul D. Franzon:
Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC. 3DIC 2009: 1-8

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