"Faulty TSVs identification and recovery in 3D stacked ICs during pre-bond ..."

Surajit Kumar Roy et al. (2013)

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DOI: 10.1109/3DIC.2013.6702339

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-22

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Surajit Kumar Roy, Sobitri Chatterjee, Chandan Giri, Hafizur Rahaman:
Faulty TSVs identification and recovery in 3D stacked ICs during pre-bond testing. 3DIC 2013: 1-6

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