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"Electrical interconnect test of 3D ICs made of dies without ESD protection ..."
Kosuke Nanbara et al. (2015)
- Kosuke Nanbara, Akihiro Odoriba, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu:
Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit. 3DIC 2015: TS8.22.1-TS8.22.5
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