"3D memory chip stacking by multi-layer self-assembly technology."

Takafumi Fukushima et al. (2013)

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DOI: 10.1109/3DIC.2013.6702360

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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  - https://dblp.org/rec/conf/3dic/FukushimaBMSSBKLK13
Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Ho-Young Son, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi:
3D memory chip stacking by multi-layer self-assembly technology. 3DIC 2013: 1-4

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