"Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and ..."

Wei Feng et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058787

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi:
Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core. 3DIC 2019: 1-4

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