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"Copper TSV-based die-level via-last 3D integration process with parylene-C ..."

S. E. Kucuk Eroglu, W. Y. Choo, Yusuf Leblebici (2016)

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DOI: 10.1109/3DIC.2016.7970016

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-13

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  dblp key:
  - conf/3dic/ErogluCL16
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  - https://dblp.org/rec/conf/3dic/ErogluCL16
S. E. Kucuk Eroglu, W. Y. Choo, Yusuf Leblebici:
Copper TSV-based die-level via-last 3D integration process with parylene-C adhesive bonding technique. 3DIC 2016: 1-5

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