"Die stacking using 3D-wafer level packaging copper/polymer through-si via ..."

Yann Civale et al. (2009)

> Home

Details and statistics

DOI: 10.1109/3DIC.2009.5306559

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/CivaleTPJADSTB09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/CivaleTPJADSTB09
Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne:
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 3DIC 2009: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.