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"Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a ..."
Jui-Chin Chen et al. (2013)
- Jui-Chin Chen, John H. Lau, Tzu-Chien Hsu, Chien-Chou Chen, Pei-Jer Tzeng, Po-Chih Chang, Chun-Hsien Chien, Yiu-Hsiang Chang, Shang-Chun Chen, Yu-Chen Hsin, Sue-Chen Liao, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao:
Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer. 3DIC 2013: 1-5
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