Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Twice-etched silicon approach for via-last through-silicon-via with a ..."

Tung Thanh Bui et al. (2015)

> Home

Details and statistics

DOI: 10.1109/3DIC.2015.7334611

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-05

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/BuiWAK15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/BuiWAK15
Tung Thanh Bui, Naoya Watanabe, Masahiro Aoyagi, Katsuya Kikuchi:
Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner. 3DIC 2015: TS8.6.1-TS8.6.4

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.