BibTeX record journals/mr/UllanLCBCGMMPP06

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@article{DBLP:journals/mr/UllanLCBCGMMPP06,
  author    = {Miguel Ull{\'{a}}n and
               Manuel Lozano and
               Mokhtar Chmeissani and
               G. Blanchot and
               Enric Cabruja and
               J. Garc{\'{\i}}a and
               M. Maiorino and
               Ricardo Mart{\'{\i}}nez and
               G. Pellegrini and
               Carles Puigdengoles},
  title     = {Test structure assembly for bump bond yield measurement on high density
               flip chip technologies},
  journal   = {Microelectronics Reliability},
  volume    = {46},
  number    = {7},
  pages     = {1095--1100},
  year      = {2006},
  url       = {https://doi.org/10.1016/j.microrel.2005.10.001},
  doi       = {10.1016/j.microrel.2005.10.001},
  timestamp = {Tue, 26 Feb 2019 17:40:19 +0100},
  biburl    = {https://dblp.org/rec/bib/journals/mr/UllanLCBCGMMPP06},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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