BibTeX record journals/mr/SunGCLW18

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@article{DBLP:journals/mr/SunGCLW18,
  author       = {Siyu Sun and
                  Qiang Guo and
                  Hongtao Chen and
                  Mingyu Li and
                  Chunqing Wang},
  title        = {Solderless bonding with nanoporous copper as interlayer for high-temperature
                  applications},
  journal      = {Microelectron. Reliab.},
  volume       = {80},
  pages        = {198--204},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2017.12.012},
  doi          = {10.1016/J.MICROREL.2017.12.012},
  timestamp    = {Sat, 22 Feb 2020 19:28:57 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/SunGCLW18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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