BibTeX record journals/mr/LiaoGWLL13

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@article{DBLP:journals/mr/LiaoGWLL13,
  author       = {Chenglong Liao and
                  Dan Guo and
                  Shizhu Wen and
                  Xinchun Lu and
                  Jianbin Luo},
  title        = {Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP
                  process using finite element method},
  journal      = {Microelectron. Reliab.},
  volume       = {53},
  number       = {5},
  pages        = {767--773},
  year         = {2013},
  url          = {https://doi.org/10.1016/j.microrel.2013.01.011},
  doi          = {10.1016/J.MICROREL.2013.01.011},
  timestamp    = {Mon, 26 Oct 2020 08:59:27 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiaoGWLL13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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