BibTeX record journals/mr/LaiW07

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@article{DBLP:journals/mr/LaiW07,
  author       = {Yi{-}Shao Lai and
                  Tong Hong Wang},
  title        = {Optimal design towards enhancement of board-level thermomechanical
                  reliability of wafer-level chip-scale packages},
  journal      = {Microelectron. Reliab.},
  volume       = {47},
  number       = {1},
  pages        = {104--110},
  year         = {2007},
  url          = {https://doi.org/10.1016/j.microrel.2006.04.008},
  doi          = {10.1016/J.MICROREL.2006.04.008},
  timestamp    = {Sat, 22 Feb 2020 19:27:55 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LaiW07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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