BibTeX record journals/mr/EndohN15

download as .bib file

@article{DBLP:journals/mr/EndohN15,
  author       = {Hirohiko Endoh and
                  Takuya Naoe},
  title        = {Copper wire bonding package decapsulation using the anodic protection
                  method},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {1},
  pages        = {207--212},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2014.10.003},
  doi          = {10.1016/J.MICROREL.2014.10.003},
  timestamp    = {Sat, 22 Feb 2020 19:27:43 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/EndohN15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.