BibTeX record journals/mr/ChengFLLWLC14

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@article{DBLP:journals/mr/ChengFLLWLC14,
  author       = {Hsi{-}Kuei Cheng and
                  Shien{-}Ping Feng and
                  Yi{-}Jen Lai and
                  Kuo{-}Chio Liu and
                  Ying{-}Lang Wang and
                  Tzeng{-}Feng Liu and
                  Chih{-}Ming Chen},
  title        = {Effect of polyimide baking on bump resistance in flip-chip solder
                  joints},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {3},
  pages        = {629--632},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2013.11.006},
  doi          = {10.1016/J.MICROREL.2013.11.006},
  timestamp    = {Sat, 22 Feb 2020 19:29:06 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ChengFLLWLC14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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