BibTeX record journals/mr/BudimanSKHSSCBTKJ12

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@article{DBLP:journals/mr/BudimanSKHSSCBTKJ12,
  author    = {A. S. Budiman and
               H.{-}A.{-}S. Shin and
               B.{-}J. Kim and
               S.{-}H. Hwang and
               H.{-}Y. Son and
               M.{-}S. Suh and
               Q.{-}H. Chung and
               K.{-}Y. Byun and
               N. Tamura and
               M. Kunz and
               Y.{-}C. Joo},
  title     = {Measurement of stresses in Cu and Si around through-silicon via by
               synchrotron X-ray microdiffraction for 3-dimensional integrated circuits},
  journal   = {Microelectronics Reliability},
  volume    = {52},
  number    = {3},
  pages     = {530--533},
  year      = {2012},
  url       = {https://doi.org/10.1016/j.microrel.2011.10.016},
  doi       = {10.1016/j.microrel.2011.10.016},
  timestamp = {Sat, 16 Sep 2017 12:06:03 +0200},
  biburl    = {https://dblp.org/rec/bib/journals/mr/BudimanSKHSSCBTKJ12},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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