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BibTeX record conf/isscc/0002TPZCKSTNZSG18
@inproceedings{DBLP:conf/isscc/0002TPZCKSTNZSG18, author = {John M. Wilson and Walker J. Turner and John W. Poulton and Brian Zimmer and Xi Chen and Sudhir S. Kudva and Sanquan Song and Stephen G. Tell and Nikola Nedovic and Wenxu Zhao and Sunil R. Sudhakaran and C. Thomas Gray and William J. Dally}, title = {A 1.17pJ/b 25Gb/s/pin ground-referenced single-ended serial link for off- and on-package communication in 16nm {CMOS} using a process- and temperature-adaptive voltage regulator}, booktitle = {2018 {IEEE} International Solid-State Circuits Conference, {ISSCC} 2018, San Francisco, CA, USA, February 11-15, 2018}, pages = {276--278}, publisher = {{IEEE}}, year = {2018}, url = {https://doi.org/10.1109/ISSCC.2018.8310291}, doi = {10.1109/ISSCC.2018.8310291}, timestamp = {Wed, 16 Oct 2019 14:14:55 +0200}, biburl = {https://dblp.org/rec/conf/isscc/0002TPZCKSTNZSG18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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